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74HCT2G17GW,125

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

74HCT2G17GW,125
Description

BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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74HCT2G17GW,125 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Seated Height:	1.1 mm
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	2 V
Surface Mount:	YES
Terminal Finish:	TIN
No. of Terminals:	6
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G6
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	TSSOP
Width:	1.25 mm
Moisture Sensitivity Level (MSL):	1
Logic IC Type:	BUFFER
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	2
Qualification:	Not Qualified
Length:	2 mm
Propagation Delay (tpd):	175 ns
Nominal Supply Voltage / Vsup (V):	5
Family:	HCT
Terminal Pitch:	.65 mm
Temperature Grade:	AUTOMOTIVE
Maximum Supply Voltage (Vsup):	6 V

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