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74LVC07APW,118

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

74LVC07APW,118
Description

BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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74LVC07APW,118 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Schmitt Trigger:	NO
Output Characteristics:	OPEN-DRAIN
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.1 mm
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	1.65 V
Sub-Category:	Gates
Surface Mount:	YES
Terminal Finish:	Nickel/Palladium/Gold (Ni/Pd/Au)
No. of Terminals:	14
Maximum I (ol):	24 Amp
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G14
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	TSSOP
Propagation Delay At Nominal Supply:	4.5 ns
Width:	4.4 mm
Moisture Sensitivity Level (MSL):	1
Packing Method:	TR
Load Capacitance (CL):	50 pF
Logic IC Type:	BUFFER
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	6
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP14,.25
Length:	5 mm
Propagation Delay (tpd):	4.5 ns
Nominal Supply Voltage / Vsup (V):	1.8
Family:	LVC/LCX/Z
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Temperature Grade:	AUTOMOTIVE
Maximum Supply Voltage (Vsup):	5.5 V
Power Supplies (V):	3.3

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