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MTFC64GAPALBH-IT

Manufacturer

Micron Technology
Manufacturer's Part Number

MTFC64GAPALBH-IT
Description

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
Datasheet

Datasheet

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MTFC64GAPALBH-IT Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	64GX8
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.1 mm
Programming Voltage (V):	2.7
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	153
Maximum Clock Frequency (fCLK):	200 MHz
No. of Words:	68719476736 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	11.5 mm
Memory Density:	549755813888 bit
Memory IC Type:	FLASH CARD
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Type:	NAND TYPE
Package Equivalence Code:	BGA153,14X14,20
Length:	13 mm
No. of Words Code:	64G
Peak Reflow Temperature (C):	260
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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