MX30LF2G18AC-XKI by Macronix

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MX30LF2G18AC-XKI

  • Manufacturer
    Macronix
  • Manufacturer's Part Number
    MX30LF2G18AC-XKI
  • Description
    FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
  • Datasheet

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MX30LF2G18AC-XKI Technical Details

TYPE DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256MX8
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1 mm
Programming Voltage (V): 3
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 63
No. of Words: 268435456 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B63
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 9 mm
Memory Density: 2147483648 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: SLC NAND TYPE
Length: 11 mm
No. of Words Code: 256M
Nominal Supply Voltage / Vsup (V): 3
Peak Reflow Temperature (C): NOT SPECIFIED
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V

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