MT61K512M32KPA-16:B by Micron Technology

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MT61K512M32KPA-16:B

Manufacturer

Micron Technology
Manufacturer's Part Number

MT61K512M32KPA-16:B
Description

GDDR6 DRAM; No. of Terminals: 180; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; No. of Functions: 1;
Datasheet

Datasheet

969 In Stock

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MT61K512M32KPA-16:B Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	512MX32
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.2 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.2125 V
Surface Mount:	YES
No. of Terminals:	180
No. of Words:	536870912 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B180
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	95 Cel
Package Code:	TFBGA
Width:	12 mm
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	17179869184 bit
Self Refresh:	YES
Memory IC Type:	GDDR6 DRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	32
No. of Functions:	1
Package Equivalence Code:	BGA180,14X18,30
Length:	14 mm
No. of Words Code:	512M
Nominal Supply Voltage / Vsup (V):	1.25
Additional Features:	AUTO/SELF REFRESH; ALSO OPERATES AT 1.35 V
Peak Reflow Temperature (C):	NOT SPECIFIED
Terminal Pitch:	.75 mm
Maximum Supply Voltage (Vsup):	1.2875 V

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