MT29F1G08ABAEAWP-IT:E by Micron Technology

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MT29F1G08ABAEAWP-IT:E

Manufacturer

Micron Technology
Manufacturer's Part Number

MT29F1G08ABAEAWP-IT:E
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; JESD-609 Code: e3;
Datasheet

Datasheet

2408 In Stock

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MT29F1G08ABAEAWP-IT:E Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	128MX8
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	2.7
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
Terminal Finish:	Matte Tin (Sn)
No. of Terminals:	48
No. of Words:	134217728 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PDSO-G48
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TSOP1
Width:	12 mm
Other Names:	186309 -MT29F1G08ABAEAWP-IT:E
Memory Density:	1073741824 bit
Memory IC Type:	FLASH
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Type:	SLC NAND TYPE
Length:	18.4 mm
No. of Words Code:	128M
Nominal Supply Voltage / Vsup (V):	3.3
Peak Reflow Temperature (C):	260
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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