EDB4432BBBJ-1DAAT-F-R by Micron Technology

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EDB4432BBBJ-1DAAT-F-R

Manufacturer

Micron Technology
Manufacturer's Part Number

EDB4432BBBJ-1DAAT-F-R
Description

LPDDR2 DRAM; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
Datasheet

Datasheet

2096 In Stock

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EDB4432BBBJ-1DAAT-F-R Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	128MX32
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	.75 mm
Access Mode:	SINGLE BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.14 V
Surface Mount:	YES
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals:	134
No. of Words:	134217728 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B134
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Package Code:	VFBGA
Width:	10 mm
No. of Ports:	1
Memory Density:	4294967296 bit
Self Refresh:	YES
Memory IC Type:	LPDDR2 DRAM
JESD-609 Code:	e1
Memory Width:	32
No. of Functions:	1
Length:	11.5 mm
No. of Words Code:	128M
Nominal Supply Voltage / Vsup (V):	1.2
Additional Features:	AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Maximum Supply Voltage (Vsup):	1.95 V

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