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MCP2562FDT-E/MF
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ManufacturerMicrochip Technology
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Manufacturer's Part NumberMCP2562FDT-E/MF
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DescriptionCAN FD TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;
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Datasheet
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DetailsMCP2562FDT-E/MF Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 70 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 8 |
| No. of Transceivers: | 1 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Data Rate: | 8 Mbps |
| Screening Level: | TS 16949 |
| JESD-30 Code: | S-PDSO-N8 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | HVSON |
| Width: | 3 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | CAN FD TRANSCEIVER |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | SOLCC8,.12,25 |
| Length: | 3 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | AUTOMOTIVE |
