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BM77SPPS3MC2-0007AA

Manufacturer

Microchip Technology
Manufacturer's Part Number

BM77SPPS3MC2-0007AA
Description

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: XMA; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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BM77SPPS3MC2-0007AA Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	1.86 mm
Surface Mount:	YES
Minimum Operating Temperature:	-20 Cel
No. of Functions:	1
No. of Terminals:	30
Package Equivalence Code:	MODULE,30LEAD(UNSPEC)
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Data Rate:	.1125 Mbps
Length:	15 mm
JESD-30 Code:	R-XXMA-N30
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	70 Cel
Peak Reflow Temperature (C):	NOT SPECIFIED
Package Code:	XMA
Width:	12 mm
Terminal Pitch:	1.1 mm
Temperature Grade:	COMMERCIAL

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