BGSF18DM20E6327XUMA1 by Infineon Technologies

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BGSF18DM20E6327XUMA1

Manufacturer

Infineon Technologies
Manufacturer's Part Number

BGSF18DM20E6327XUMA1
Description

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 20; Package Code: HLGA; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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BGSF18DM20E6327XUMA1 Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	3.5 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.98 mm
Surface Mount:	YES
Terminal Finish:	GOLD NICKEL
JESD-609 Code:	e4
Minimum Operating Temperature:	-30 Cel
No. of Functions:	1
No. of Terminals:	20
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, HEAT SINK/SLUG
Length:	3.2 mm
Technology:	CMOS
JESD-30 Code:	R-XBGA-B20
Package Shape:	RECTANGULAR
Terminal Form:	BUTT
Maximum Operating Temperature:	85 Cel
Package Code:	HLGA
Width:	2.8 mm
Terminal Pitch:	.4 mm
Temperature Grade:	OTHER
Moisture Sensitivity Level (MSL):	3

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