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25LC256-E/ST
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ManufacturerMicrochip Technology
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Manufacturer's Part Number25LC256-E/ST
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DescriptionEEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
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Datasheet
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Details25LC256-E/ST Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Programming Voltage (V): | 4.5 |
| Minimum Supply Voltage (Vsup): | 2.5 V |
| Sub-Category: | EEPROMs |
| Surface Mount: | YES |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Package Code: | TSSOP |
| Moisture Sensitivity Level (MSL): | 1 |
| No. of Ports: | 1 |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP8,.25 |
| Minimum Data Retention Time: | 200 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Maximum Standby Current: | .000005 Amp |
| Organization: | 32KX8 |
| Maximum Seated Height: | 1.2 mm |
| Maximum Supply Current: | 6 mA |
| Terminal Finish: | Matte Tin (Sn) |
| Maximum Write Cycle Time (tWC): | 5 ms |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 10 MHz |
| No. of Words: | 32768 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Write Protection: | HARDWARE/SOFTWARE |
| JESD-30 Code: | R-PDSO-G8 |
| Maximum Operating Temperature: | 125 Cel |
| Endurance: | 1000000 Write/Erase Cycles |
| Width: | 3 mm |
| Serial Bus Type: | SPI |
| Memory Density: | 262144 bit |
| Memory IC Type: | EEPROM |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Length: | 4.4 mm |
| No. of Words Code: | 32K |
| Nominal Supply Voltage / Vsup (V): | 4.5 |
| Parallel or Serial: | SERIAL |
| Temperature Grade: | AUTOMOTIVE |
| Maximum Supply Voltage (Vsup): | 5.5 V |
| Power Supplies (V): | 3/5 |