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MAX31865ATP+
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ManufacturerMaxim Integrated
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Manufacturer's Part NumberMAX31865ATP+
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DescriptionANALOG CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
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Datasheet
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DetailsMAX31865ATP+ Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 5 mm |
| Maximum Seated Height: | .8 mm |
| Minimum Supply Voltage (Vsup): | 3 V |
| Maximum Supply Current (Isup): | 3.5 mA |
| Sub-Category: | Other Analog ICs |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 20 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| JESD-30 Code: | S-XQCC-N20 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | HVQCCN |
| Nominal Supply Voltage (Vsup): | 3.3 V |
| Moisture Sensitivity Level (MSL): | 1 |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC20,.20SQ,25 |
| Other IC type: | ANALOG CIRCUIT |
| Length: | 5 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | AUTOMOTIVE |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3.3 |