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LMP8601QMAX/NOPB
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ManufacturerNational Semiconductor
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Manufacturer's Part NumberLMP8601QMAX/NOPB
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DescriptionANALOG CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
3691 In Stock
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DetailsLMP8601QMAX/NOPB Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Supply Current (Isup): | 1.5 mA |
| Sub-Category: | Other Analog ICs |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 8 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| JESD-30 Code: | R-PDSO-G8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | SOP |
| Moisture Sensitivity Level (MSL): | 1 |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOP8,.25 |
| Other IC type: | ANALOG CIRCUIT |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 3.3/5 |
