LMP8601QMAX/NOPB by National Semiconductor

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LMP8601QMAX/NOPB

Manufacturer

National Semiconductor
Manufacturer's Part Number

LMP8601QMAX/NOPB
Description

ANALOG CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet

Datasheet

Not In Stock

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LMP8601QMAX/NOPB Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Supply Current (Isup):	1.5 mA
Sub-Category:	Other Analog ICs
Surface Mount:	YES
Terminal Finish:	MATTE TIN
No. of Terminals:	8
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
JESD-30 Code:	R-PDSO-G8
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	SOP
Moisture Sensitivity Level (MSL):	1
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	SOP8,.25
Other IC type:	ANALOG CIRCUIT
Peak Reflow Temperature (C):	260
Terminal Pitch:	1.27 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	3.3/5

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