THGBMJG6C1LBAIL by Kioxia Holdings

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THGBMJG6C1LBAIL

  • Manufacturer
    Kioxia Holdings
  • Manufacturer's Part Number
    THGBMJG6C1LBAIL
  • Description
    FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Length: 13 mm;
  • Datasheet

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THGBMJG6C1LBAIL Technical Details

TYPE DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 8GX8
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 153
No. of Words: 8589934592 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 11 mm
Memory Density: 68719476736 bit
Memory IC Type: FLASH CARD
Minimum Operating Temperature: -25 Cel
Memory Width: 8
No. of Functions: 1
Package Equivalence Code: BGA153,14X14,20
Length: 13 mm
No. of Words Code: 8G
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 3.6 V

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