ISL32275EFVZ-T by Integrated Device Technology

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ISL32275EFVZ-T

Manufacturer

Integrated Device Technology
Manufacturer's Part Number

ISL32275EFVZ-T
Description

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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ISL32275EFVZ-T Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	5 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.2 mm
Surface Mount:	YES
Terminal Finish:	Matte Tin (Sn) - annealed
No. of Terminals:	16
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	BICMOS
JESD-30 Code:	R-PDSO-G16
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	TSSOP
Width:	4.4 mm
Moisture Sensitivity Level (MSL):	2
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Length:	5 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Temperature Grade:	AUTOMOTIVE

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