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MCF5282CVM66J

Manufacturer

Freescale Semiconductor
Manufacturer's Part Number

MCF5282CVM66J
Description

Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet

Datasheet

Not In Stock

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MCF5282CVM66J Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	40
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	200 mA
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	256
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B256
Package Shape:	SQUARE
ROM Words:	524288
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	3
Speed:	66 rpm
RAM Bytes:	65536
Bit Size:	32
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA256,16X16,40
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	3/3.3
CPU Family:	COLDFIRE

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