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FDG6324L

Manufacturer

Fairchild Semiconductor
Manufacturer's Part Number

FDG6324L
Description

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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FDG6324L Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.1 mm
Maximum Output Current:	.6 A
Sub-Category:	Peripheral Drivers
Surface Mount:	YES
Terminal Finish:	MATTE TIN
No. of Terminals:	6
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	MOS
JESD-30 Code:	R-PDSO-G6
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Built-in Protections:	TRANSIENT
Maximum Operating Temperature:	150 Cel
Package Code:	TSSOP
Interface IC Type:	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Width:	1.25 mm
Moisture Sensitivity Level (MSL):	1
Driver No. of Bits:	1
Nominal Output Peak Current Limit:	.27 A
JESD-609 Code:	e3
Minimum Operating Temperature:	-55 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP6,.08
Output Current Flow Direction:	SOURCE
Length:	2 mm
Additional Features:	ESD PROTECTED
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Temperature Grade:	MILITARY
Power Supplies (V):	3/20

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