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MAX13035EETE+
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ManufacturerAnalog Devices
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Manufacturer's Part NumberMAX13035EETE+
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DescriptionINTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
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Datasheet
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DetailsMAX13035EETE+ Technical Details
TYPE | DESCRIPTION |
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Minimum Supply Voltage: | 1.62 V |
Package Body Material: | UNSPECIFIED |
Minimum Supply Voltage-1: | 2.2 V |
Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .8 mm |
Sub-Category: | Other Interface ICs |
Surface Mount: | YES |
Terminal Finish: | Matte Tin (Sn) - annealed |
No. of Terminals: | 16 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | BICMOS |
JESD-30 Code: | S-XQCC-N16 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVQCCN |
Interface IC Type: | INTERFACE CIRCUIT |
Width: | 4 mm |
Nominal Supply Voltage-1: | 3.3 V |
Maximum Supply Voltage-1: | 3.6 V |
Moisture Sensitivity Level (MSL): | 1 |
Maximum Supply Voltage: | 3.2 V |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC16,.16SQ,25 |
Length: | 4 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .65 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.5/3.3 |