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ADRV9009BBCZ
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ManufacturerAnalog Devices
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Manufacturer's Part NumberADRV9009BBCZ
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;
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Datasheet
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DetailsADRV9009BBCZ Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Other Names: | 505-ADRV9009BBCZ ADRV9009BBCZ-ND -2735-ADRV9009BBCZ |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.27 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 196 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 12 mm |
| JESD-30 Code: | S-PBGA-B196 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | LFBGA |
| Width: | 12 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 3 |
