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AS4C16M16SA-6BIN

Manufacturer

Alliance Memory
Manufacturer's Part Number

AS4C16M16SA-6BIN
Description

SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
Datasheet

Datasheet

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AS4C16M16SA-6BIN Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.025 Amp
Organization:	16MX16
Maximum Seated Height:	1.2 mm
Access Mode:	FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup):	3 V
Surface Mount:	YES
Maximum Supply Current:	60 mA
No. of Terminals:	54
Maximum Clock Frequency (fCLK):	166 MHz
No. of Words:	16777216 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	S-PBGA-B54
Package Shape:	SQUARE
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	8 mm
Moisture Sensitivity Level (MSL):	3
Other Names:	1450-1250 Q11922279
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	268435456 bit
Self Refresh:	YES
Sequential Burst Length:	1,2,4,8,FP
Memory IC Type:	SYNCHRONOUS DRAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Package Equivalence Code:	BGA54,9X9,32
Refresh Cycles:	8192
Interleaved Burst Length:	1,2,4,8
Length:	8 mm
Maximum Access Time:	5 ns
No. of Words Code:	16M
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	AUTO/SELF REFRESH
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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