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XCF32PFS48C

Manufacturer

Xilinx
Manufacturer's Part Number

XCF32PFS48C
Description

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet

Datasheet

147 In Stock

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XCF32PFS48C Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32MX1
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.2 mm
Minimum Supply Voltage (Vsup):	1.65 V
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	40 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	48
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B48
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Endurance:	20000 Write/Erase Cycles
Package Code:	TFBGA
Width:	8 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	33554432 bit
Memory IC Type:	CONFIGURATION MEMORY
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
Memory Width:	1
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA48,6X8,32
Length:	9 mm
No. of Words Code:	32M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
Minimum Data Retention Time:	20
Peak Reflow Temperature (C):	240
Parallel or Serial:	SERIAL
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	2 V
Power Supplies (V):	1.5/3.3,1.8

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