XCF02SVOG20CES by Xilinx

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XCF02SVOG20CES

  • Manufacturer
    Xilinx
  • Manufacturer's Part Number
    XCF02SVOG20CES
  • Description
    CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
  • Datasheet

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XCF02SVOG20CES Technical Details

TYPE DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2MX1
Maximum Seated Height: 1.19 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Terminal Finish: MATTE TIN
No. of Terminals: 20
No. of Words: 2097152 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G20
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Width: 4.4 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 2097152 bit
Memory IC Type: CONFIGURATION MEMORY
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
Length: 6.5024 mm
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: SERIAL
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V

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