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XCF02SVOG20C

Manufacturer

Xilinx
Manufacturer's Part Number

XCF02SVOG20C
Description

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;
Datasheet

Datasheet

Not In Stock

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XCF02SVOG20C Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.001 Amp
Organization:	2MX1
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.19 mm
Minimum Supply Voltage (Vsup):	3 V
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	10 mA
Terminal Finish:	Matte Tin (Sn)
No. of Terminals:	20
No. of Words:	2097152 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G20
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Endurance:	20000 Write/Erase Cycles
Package Code:	TSSOP
Width:	4.4 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	2097152 bit
Memory IC Type:	CONFIGURATION MEMORY
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Memory Width:	1
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP20,.25
Length:	6.5024 mm
No. of Words Code:	2M
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
Minimum Data Retention Time:	20
Peak Reflow Temperature (C):	260
Parallel or Serial:	SERIAL
Terminal Pitch:	.65 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V
Power Supplies (V):	1.8/3.3,3.3

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XCF02SVOG20C Technical Details

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