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XCF02SVO20C0936

Manufacturer

Xilinx
Manufacturer's Part Number

XCF02SVO20C0936
Description

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.19 mm;
Datasheet

Datasheet

257 In Stock

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XCF02SVO20C0936 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	2MX1
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.19 mm
Minimum Supply Voltage (Vsup):	3 V
Surface Mount:	YES
Terminal Finish:	TIN LEAD
No. of Terminals:	20
No. of Words:	2097152 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G20
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TSSOP
Width:	4.4 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	2097152 bit
Memory IC Type:	CONFIGURATION MEMORY
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
Memory Width:	1
No. of Functions:	1
Qualification:	Not Qualified
Length:	6.5024 mm
No. of Words Code:	2M
Nominal Supply Voltage / Vsup (V):	3.3
Peak Reflow Temperature (C):	225
Parallel or Serial:	SERIAL
Terminal Pitch:	.65 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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