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W25N01GVZEIG
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ManufacturerWinbond Electronics
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Manufacturer's Part NumberW25N01GVZEIG
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DescriptionFLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
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Datasheet
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DetailsW25N01GVZEIG Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 1GX1 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .8 mm |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 35 mA |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 104 MHz |
| No. of Words: | 1073741824 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-N8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | HVSON |
| Width: | 6 mm |
| Serial Bus Type: | SPI |
| Other Names: | 256-W25N01GVZEIG-ND 256-W25N01GVZEIG |
| Memory Density: | 1073741824 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOLCC8,.3 |
| Length: | 8 mm |
| No. of Words Code: | 1G |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Minimum Data Retention Time: | 10 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3/3.3 |