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TXB0108YZPR2

Manufacturer

Texas Instruments
Manufacturer's Part Number

TXB0108YZPR2
Description

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 20; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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TXB0108YZPR2 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	1.2 V
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	1.5 V
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	.5 mm
Surface Mount:	YES
Maximum Supply Current:	.01 mA
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals:	20
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
JESD-30 Code:	R-XBGA-B20
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Interface IC Type:	INTERFACE CIRCUIT
Width:	1.888 mm
Moisture Sensitivity Level (MSL):	1
No. of Bits:	8
Maximum Supply Voltage:	3.6 V
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Length:	2.388 mm
Additional Features:	ALSO HAVE 1.65 TO 5.5 INPUT VOLTAGE
Peak Reflow Temperature (C):	260
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL

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