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TXB0108YZPR

Manufacturer

Texas Instruments
Manufacturer's Part Number

TXB0108YZPR
Description

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 20; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet

Datasheet

2722 In Stock

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TXB0108YZPR Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	1.2 V
Package Body Material:	PLASTIC/EPOXY
Minimum Supply Voltage-1:	1.65 V
Nominal Supply Voltage:	1.5 V
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	.5 mm
Sub-Category:	Other Interface ICs
Surface Mount:	YES
Maximum Supply Current:	.01 mA
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals:	20
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
JESD-30 Code:	R-PBGA-B20
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Interface IC Type:	INTERFACE CIRCUIT
Width:	1.9 mm
Nominal Supply Voltage-1:	1.8 V
Maximum Supply Voltage-1:	5.5 V
Moisture Sensitivity Level (MSL):	1
No. of Bits:	8
Other Names:	-296-29803-1-ND -296-29803-1 TEXTISTXB0108YZPR 2156-TXB0108YZPR 296-29803-1 296-29803-2 -TXB0108YZPR-NDR 296-29803-6
Maximum Supply Voltage:	3.6 V
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA20,4X5,20
Length:	2.4 mm
Additional Features:	HTTP://WWW.TI.COM/LIT/ML/MXBG100B/MXBG100B.PDF
Peak Reflow Temperature (C):	260
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	1.2/3.6,1.8/5

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