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SN74LVC1G17YZVR

Manufacturer

Texas Instruments
Manufacturer's Part Number

SN74LVC1G17YZVR
Description

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: SQUARE;
Datasheet

Datasheet

Not In Stock

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SN74LVC1G17YZVR Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Schmitt Trigger:	YES
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	.5 mm
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	1.65 V
Sub-Category:	Gates
Maximum Power Supply Current (ICC):	.01 mA
Surface Mount:	YES
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals:	4
Maximum I (ol):	24 Amp
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	S-XBGA-B4
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Propagation Delay At Nominal Supply:	5.5 ns
Width:	.9 mm
Moisture Sensitivity Level (MSL):	1
Packing Method:	TR
Load Capacitance (CL):	50 pF
Logic IC Type:	BUFFER
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA4,2X2,20
Length:	.9 mm
Propagation Delay (tpd):	11 ns
Nominal Supply Voltage / Vsup (V):	3.3
Family:	LVC/LCX/Z
Peak Reflow Temperature (C):	260
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	5.5 V
Power Supplies (V):	3.3

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