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SN74LVC1G07DCK3

Manufacturer

Texas Instruments
Manufacturer's Part Number

SN74LVC1G07DCK3
Description

BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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SN74LVC1G07DCK3 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Output Characteristics:	OPEN-DRAIN
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.1 mm
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	1.65 V
Maximum Power Supply Current (ICC):	.01 mA
Surface Mount:	YES
Terminal Finish:	Tin/Bismuth (Sn/Bi)
No. of Terminals:	5
Maximum I (ol):	32 Amp
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G5
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	TSSOP
Width:	1.25 mm
Moisture Sensitivity Level (MSL):	1
Logic IC Type:	BUFFER
JESD-609 Code:	e6
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Length:	2 mm
Propagation Delay (tpd):	8.6 ns
Nominal Supply Voltage / Vsup (V):	3.3
Family:	LVC/LCX/Z
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Temperature Grade:	AUTOMOTIVE
Maximum Supply Voltage (Vsup):	5.5 V

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