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SN65DSI86IPAPQ1

Manufacturer

Texas Instruments
Manufacturer's Part Number

SN65DSI86IPAPQ1
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HTFQFP; Package Shape: SQUARE;
Datasheet

Datasheet

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SN65DSI86IPAPQ1 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.2 V
Maximum Time At Peak Reflow Temperature (s):	30
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	1.2 mm
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	64
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Length:	10 mm
JESD-30 Code:	S-PQFP-G64
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	HTFQFP
Width:	10 mm
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	3

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