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ISOW7741BDFMR

Manufacturer

Texas Instruments
Manufacturer's Part Number

ISOW7741BDFMR
Description

INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: HSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
Datasheet

Datasheet

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ISOW7741BDFMR Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	2.97 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Seated Height:	3.55 mm
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
No. of Terminals:	20
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
JESD-30 Code:	R-PDSO-G20
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
No. of Channels:	4
Package Code:	HSOP
Interface IC Type:	INTERFACE CIRCUIT
Width:	7.5 mm
Moisture Sensitivity Level (MSL):	3
Maximum Supply Voltage:	3.63 V
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	4
Package Equivalence Code:	SOP20,.4
Length:	12.83 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	1.27 mm

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