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ISO7741FQDBQQ1

Manufacturer

Texas Instruments
Manufacturer's Part Number

ISO7741FQDBQQ1
Description

INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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ISO7741FQDBQQ1 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	2.25 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	2.5 V
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.75 mm
Surface Mount:	YES
Terminal Finish:	Nickel/Palladium/Gold (Ni/Pd/Au)
No. of Terminals:	16
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, SHRINK PITCH
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	R-PDSO-G16
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
No. of Channels:	4
Package Code:	SSOP
Interface IC Type:	INTERFACE CIRCUIT
Width:	3.895 mm
Moisture Sensitivity Level (MSL):	2
Maximum Supply Voltage:	5.5 V
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	4
Package Equivalence Code:	SSOP16,.25
Length:	4.905 mm
Additional Features:	ALSO REQUIRED (VCC2) 2.25-5.5V SUPPLY
Peak Reflow Temperature (C):	260
Terminal Pitch:	.635 mm
Temperature Grade:	AUTOMOTIVE

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