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CC3100MODR11MAMOBR

Manufacturer

Texas Instruments
Manufacturer's Part Number

CC3100MODR11MAMOBR
Description

WIRELESS LAN CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 63; Package Code: LGA; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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CC3100MODR11MAMOBR Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	2.38 mm
Surface Mount:	YES
Terminal Finish:	NICKEL GOLD
No. of Terminals:	63
No. of Transceivers:	1
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
JESD-30 Code:	R-PBGA-B63
Package Shape:	RECTANGULAR
Terminal Form:	BUTT
Maximum Operating Temperature:	70 Cel
Package Code:	LGA
Width:	17.5 mm
Moisture Sensitivity Level (MSL):	3
Telecom IC Type:	WIRELESS LAN CIRCUIT
JESD-609 Code:	e4
Minimum Operating Temperature:	-20 Cel
No. of Functions:	1
Length:	20.5 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	1.27 mm
Temperature Grade:	OTHER

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