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1120
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ManufacturerTelcom Semiconductor
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Manufacturer's Part Number1120
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DescriptionOther Interface ICs; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
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Datasheet
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Details1120 Technical Details
TYPE | DESCRIPTION |
---|---|
Package Body Material: | CERAMIC |
Nominal Supply Voltage: | 24 V |
Sub-Category: | Other Interface ICs |
Surface Mount: | NO |
Terminal Finish: | Tin/Lead (Sn/Pb) |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 24 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP24,.8 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
JESD-30 Code: | R-XDIP-T24 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Nominal Negative Supply Voltage: | -24 V |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | +-24 |