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MPU-6050
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ManufacturerTDK
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Manufacturer's Part NumberMPU-6050
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DescriptionANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
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Datasheet
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DetailsMPU-6050 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Width (mm): | 4 mm |
Maximum Seated Height: | .95 mm |
Minimum Supply Voltage (Vsup): | 2.375 V |
Sub-Category: | Other Analog ICs |
Surface Mount: | YES |
Terminal Finish: | NICKEL PALLADIUM GOLD |
No. of Terminals: | 24 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | S-XQCC-N24 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVQCCN |
Nominal Supply Voltage (Vsup): | 2.5 V |
Moisture Sensitivity Level (MSL): | 3 |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC24,.16,20 |
Other IC type: | ANALOG CIRCUIT |
Length: | 4 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.46 V |
Power Supplies (V): | 1.8,2.5/3.3 |