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TS555CJ
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ManufacturerSTMicroelectronics
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Manufacturer's Part NumberTS555CJ
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DescriptionAnalog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsTS555CJ Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | CERAMIC |
Sub-Category: | Analog Waveform Generation Functions |
Surface Mount: | NO |
Terminal Finish: | Tin/Lead (Sn/Pb) |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP8,.3 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-XDIP-T8 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 5/18 |