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STM32F373RBT6
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ManufacturerSTMicroelectronics
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Manufacturer's Part NumberSTM32F373RBT6
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DescriptionMICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
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Datasheet
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DetailsSTM32F373RBT6 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2 V |
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Address Bus Width: | 0 |
| Technology: | CMOS |
| Maximum Clock Frequency: | 32 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Package Code: | LFQFP |
| Bit Size: | 32 |
| DAC Channels: | YES |
| Qualification: | Not Qualified |
| Package Equivalence Code: | QFP64,.47SQ,20 |
| Digital To Analog Convertors: | 3-Ch 12-Bit |
| PWM Channels: | YES |
| Connectivity: | CAN, HDMI-CEC, I2C(2), I2S(3), IRDA, LIN, SPI(3), USART(3), USB |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| ROM Programmability: | FLASH |
| Analog To Digital Convertors: | 16-Ch 12-Bit, 8-Ch 16-Bit |
| Terminal Pitch: | .5 mm |
| CPU Family: | CORTEX-M4F |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Seated Height: | 1.6 mm |
| Maximum Supply Current: | 75.7 mA |
| ADC Channels: | YES |
| No. of Terminals: | 64 |
| DMA Channels: | YES |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK, LOW PROFILE, FINE PITCH |
| No. of I/O Lines: | 52 |
| JESD-30 Code: | S-PQFP-G64 |
| ROM Words: | 131072 |
| Maximum Operating Temperature: | 85 Cel |
| Width: | 10 mm |
| Other Names: | 497-13314 |
| Data EEPROM Size: | 0 |
| Speed: | 72 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| Maximum Supply Voltage: | 3.6 V |
| RAM Bytes: | 24576 |
| External Data Bus Width: | 0 |
| Peripherals: | COMPARATOR(2), DMA(12), POR, RTC, TIMER(17) |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 10 mm |
| On Chip Program ROM Width: | 8 |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 2.5/3.3 |