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STM32F103TBU6
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ManufacturerSTMicroelectronics
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Manufacturer's Part NumberSTM32F103TBU6
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DescriptionMICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
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Datasheet
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DetailsSTM32F103TBU6 Technical Details
TYPE | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 2 V |
Package Body Material: | UNSPECIFIED |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Address Bus Width: | 0 |
Technology: | CMOS |
Maximum Clock Frequency: | 25 MHz |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Package Code: | HVQCCN |
Moisture Sensitivity Level (MSL): | 3 |
Bit Size: | 32 |
DAC Channels: | NO |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC36,.25SQ,20 |
PWM Channels: | YES |
Connectivity: | CAN, I2C, IRDA, LIN, PMBUS, SMBUS, SPI, USART(2), USB |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 10-Ch 12-Bit |
Terminal Pitch: | .5 mm |
CPU Family: | CORTEX-M3 |
Nominal Supply Voltage: | 3.3 V |
Maximum Seated Height: | 1 mm |
Maximum Supply Current: | 50 mA |
Terminal Finish: | MATTE TIN |
ADC Channels: | YES |
No. of Terminals: | 36 |
DMA Channels: | YES |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
No. of I/O Lines: | 26 |
JESD-30 Code: | S-XQCC-N36 |
ROM Words: | 131072 |
Maximum Operating Temperature: | 85 Cel |
Width: | 6 mm |
Data EEPROM Size: | 0 |
Speed: | 72 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 3.6 V |
RAM Bytes: | 20480 |
External Data Bus Width: | 0 |
Peripherals: | DMA(7), POR, PWM, RTC, TIMER(4), WDT(2) |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Length: | 6 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.5/3.3 |