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LSM9DS1TR
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ManufacturerSTMicroelectronics
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Manufacturer's Part NumberLSM9DS1TR
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DescriptionANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TFLGA; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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DetailsLSM9DS1TR Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Width (mm): | 3 mm |
Maximum Seated Height: | 1.027 mm |
Minimum Supply Voltage (Vsup): | 1.9 V |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 24 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Other IC type: | ANALOG CIRCUIT |
Length: | 3.5 mm |
JESD-30 Code: | R-PBGA-B24 |
Package Shape: | RECTANGULAR |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | TFLGA |
Nominal Supply Voltage (Vsup): | 2.2 V |
Terminal Pitch: | .43 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |
Moisture Sensitivity Level (MSL): | 3 |