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LSM303DLM
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ManufacturerSTMicroelectronics
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Manufacturer's Part NumberLSM303DLM
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DescriptionANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: VFLGA; Package Shape: SQUARE; Surface Mount: YES;
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Datasheet
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DetailsLSM303DLM Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 5 mm |
| Maximum Seated Height: | 1 mm |
| Minimum Supply Voltage (Vsup): | 2.16 V |
| Sub-Category: | Other Analog ICs |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL GOLD |
| No. of Terminals: | 28 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B28 |
| Package Shape: | SQUARE |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFLGA |
| Nominal Supply Voltage (Vsup): | 2.5 V |
| Moisture Sensitivity Level (MSL): | 3 |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC28,.2SQ,22 |
| Other IC type: | ANALOG CIRCUIT |
| Length: | 5 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .55 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 2.5 |
