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USB3300-EZK

Manufacturer

Standard Microsystems
Manufacturer's Part Number

USB3300-EZK
Description

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
Datasheet

Datasheet

Not In Stock

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USB3300-EZK Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	3.3 V
Telecom IC Type:	INTERFACE CIRCUIT
Maximum Seated Height:	1 mm
Surface Mount:	YES
Terminal Finish:	MATTE TIN
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	32
Qualification:	Not Qualified
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length:	5 mm
JESD-30 Code:	S-XQCC-N32
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	HVQCCN
Width:	5 mm
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	3

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INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;