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S25FL128SAGBHI200

Manufacturer

Spansion
Manufacturer's Part Number

S25FL128SAGBHI200
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Organization: 32MX4;
Datasheet

Datasheet

819 In Stock

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S25FL128SAGBHI200 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.0001 Amp
Organization:	32MX4
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	2.7 V
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	100 mA
Maximum Write Cycle Time (tWC):	500 ms
No. of Terminals:	24
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Write Protection:	HARDWARE/SOFTWARE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B24
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Endurance:	100000 Write/Erase Cycles
Package Code:	TBGA
Width:	6 mm
Serial Bus Type:	SPI
Memory Density:	134217728 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	4
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA24,5X5,40
Alternate Memory Width:	2
Length:	8 mm
No. of Words Code:	32M
Nominal Supply Voltage / Vsup (V):	3
Additional Features:	ALSO CONFIGURABLE AS 128M X 1
Minimum Data Retention Time:	20
Parallel or Serial:	SERIAL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V
Power Supplies (V):	3/3.3

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