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SDINBDG4-8G-XI1

Manufacturer

Sandisk
Manufacturer's Part Number

SDINBDG4-8G-XI1
Description

FLASH CARD; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 8GX8; Surface Mount: YES;
Datasheet

Not In Stock

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SDINBDG4-8G-XI1 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	8GX8
Maximum Seated Height:	.8 mm
Programming Voltage (V):	3.3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER NICKEL GERMANIUM
No. of Terminals:	153
Maximum Clock Frequency (fCLK):	200 MHz
No. of Words:	8589934592 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Endurance:	3000 Write/Erase Cycles
Package Code:	VFBGA
Width:	11.5 mm
Memory Density:	68719476736 bit
Memory IC Type:	FLASH CARD
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Type:	MLC NAND TYPE
Package Equivalence Code:	BGA153,14X14,20
Length:	13 mm
No. of Words Code:	8G
Nominal Supply Voltage / Vsup (V):	3.3
Minimum Data Retention Time:	1
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Maximum Supply Voltage (Vsup):	3.6 V

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