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LE25U20AMB-AH
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ManufacturerOnsemi
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Manufacturer's Part NumberLE25U20AMB-AH
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DescriptionFLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 2.5/3.3;
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Datasheet
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DetailsLE25U20AMB-AH Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00001 Amp |
Organization: | 256KX8 |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.75 mm |
Programming Voltage (V): | 2.7 |
Minimum Supply Voltage (Vsup): | 2.3 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 15 mA |
Terminal Finish: | MATTE TIN |
Maximum Write Cycle Time (tWC): | 15 ms |
No. of Terminals: | 8 |
Maximum Clock Frequency (fCLK): | 30 MHz |
No. of Words: | 262144 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE |
Write Protection: | HARDWARE/SOFTWARE |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G8 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 100000 Write/Erase Cycles |
Package Code: | SOP |
Width: | 3.9 mm |
Moisture Sensitivity Level (MSL): | 3 |
Serial Bus Type: | SPI |
Memory Density: | 2097152 bit |
Memory IC Type: | FLASH |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Type: | NOR TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | SOP8,.25 |
Length: | 4.9 mm |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Minimum Data Retention Time: | 20 |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | SERIAL |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |
Power Supplies (V): | 2.5/3.3 |