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FXLP4555MPX

Manufacturer

Onsemi
Manufacturer's Part Number

FXLP4555MPX
Description

ANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
Datasheet

Datasheet

2188 In Stock

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FXLP4555MPX Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s):	30
Width (mm):	3 mm
Maximum Seated Height:	.8 mm
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
No. of Terminals:	16
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
JESD-30 Code:	S-XQCC-N16
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Package Code:	HVQCCN
Nominal Supply Voltage (Vsup):	3 V
Moisture Sensitivity Level (MSL):	1
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Other IC type:	ANALOG CIRCUIT
Length:	3 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	5.5 V

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