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FIS1100
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ManufacturerOnsemi
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Manufacturer's Part NumberFIS1100
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DescriptionANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: HLGA; Package Shape: SQUARE; Surface Mount: YES;
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Datasheet
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DetailsFIS1100 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Width (mm): | 3.3 mm |
Maximum Seated Height: | 1 mm |
Minimum Supply Voltage (Vsup): | 2.4 V |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 16 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Other IC type: | ANALOG CIRCUIT |
Length: | 3.3 mm |
JESD-30 Code: | S-XBGA-B16 |
Package Shape: | SQUARE |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | HLGA |
Nominal Supply Voltage (Vsup): | 2.7 V |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3 V |
Moisture Sensitivity Level (MSL): | 3 |