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FIS1100
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ManufacturerOnsemi
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Manufacturer's Part NumberFIS1100
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DescriptionANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: HLGA; Package Shape: SQUARE; Surface Mount: YES;
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Datasheet
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DetailsFIS1100 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 3.3 mm |
| Maximum Seated Height: | 1 mm |
| Minimum Supply Voltage (Vsup): | 2.4 V |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Other IC type: | ANALOG CIRCUIT |
| Length: | 3.3 mm |
| JESD-30 Code: | S-XBGA-B16 |
| Package Shape: | SQUARE |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HLGA |
| Nominal Supply Voltage (Vsup): | 2.7 V |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3 V |
| Moisture Sensitivity Level (MSL): | 3 |