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SE556-1F
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberSE556-1F
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DescriptionPULSE; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsSE556-1F Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC, GLASS-SEALED |
| Width (mm): | 7.62 mm |
| Maximum Seated Height: | 5.08 mm |
| Minimum Supply Voltage (Vsup): | 4.5 V |
| Maximum Supply Current (Isup): | 24 mA |
| Surface Mount: | NO |
| Maximum Output Frequency: | .5 GHz |
| Minimum Operating Temperature: | -55 Cel |
| No. of Functions: | 2 |
| No. of Terminals: | 14 |
| Qualification: | Not Qualified |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Other IC type: | PULSE |
| Length: | 19.535 mm |
| JESD-30 Code: | R-GDIP-T14 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | DIP |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
| Maximum Supply Voltage (Vsup): | 18 V |
