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SC18IS602BIPW/S8

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

SC18IS602BIPW/S8
Description

BUS CONTROLLER, I2C; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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SC18IS602BIPW/S8 Technical Details

TYPE	DESCRIPTION
Minimum Supply Voltage:	2.4 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.1 mm
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
No. of Terminals:	16
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Address Bus Width:	0
Maximum Data Transfer Rate:	.225 MBps
Technology:	CMOS
JESD-30 Code:	R-PDSO-G16
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	TSSOP
Width:	4.4 mm
Moisture Sensitivity Level (MSL):	1
Peripheral IC Type:	BUS CONTROLLER, I2C
Maximum Supply Voltage:	3.6 V
External Data Bus Width:	0
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
Length:	5 mm
Peak Reflow Temperature (C):	260
Bus Compatibility:	I2C
Terminal Pitch:	.65 mm
Temperature Grade:	INDUSTRIAL

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