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SA558F
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberSA558F
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DescriptionPULSE; RECTANGULAR; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsSA558F Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | CERAMIC, GLASS-SEALED |
Width (mm): | 7.62 mm |
Maximum Seated Height: | 5.08 mm |
Minimum Supply Voltage (Vsup): | 4.5 V |
Maximum Supply Current (Isup): | 36 mA |
Surface Mount: | NO |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 4 |
No. of Terminals: | 16 |
Qualification: | Not Qualified |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Other IC type: | PULSE; RECTANGULAR |
Length: | 19.535 mm |
JESD-30 Code: | R-GDIP-T16 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 85 Cel |
Package Code: | DIP |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 16 V |