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PSSI2021SAY,115
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberPSSI2021SAY,115
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DescriptionANALOG CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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DetailsPSSI2021SAY,115 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Width (mm): | 1.25 mm |
Maximum Seated Height: | 1.1 mm |
Maximum Supply Current (Isup): | 2.2 mA |
Sub-Category: | Power Management Circuits |
Surface Mount: | YES |
Terminal Finish: | TIN |
No. of Terminals: | 5 |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
JESD-30 Code: | R-PDSO-G5 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 150 Cel |
Package Code: | TSSOP |
Nominal Supply Voltage (Vsup): | 12 V |
Moisture Sensitivity Level (MSL): | 1 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -55 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | TSSOP5/6,.08 |
Other IC type: | ANALOG CIRCUIT |
Length: | 2 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .65 mm |
Temperature Grade: | MILITARY |
Power Supplies (V): | 12 |